Radiation Hardened Electronics & Semiconductors Market - Global Forecasts to 2013 - 2020
New Computer Technology market report from Markets and Markets: "Radiation Hardened Electronics & Semiconductors Market - Global Forecasts to 2013 - 2020"
[USPRwire, Tue Dec 30 2014] Radiation Hardened Electronics & Semiconductors Market by Component (Processors & Controllers, Logic, Memory, Power Management, ASICs & FPGAs), Manufacturing Technique (RHBP, RHBD), Application (Aerospace & Defense, Space), & Geography - Global Forecasts to 2013 - 2020
Most of the semiconductor electronic components are vulnerable to radiation damage; radiation-hardened components with some design and manufacturing variations are developed to reduce the susceptibility to radiation damage. Such rad-hard components are highly reliable and can withstand harmful space radiations. Radiation hardening is the act of making electronic components and systems resistant to damage or malfunctions caused by ionizing radiation such as those encountered in outer space, high-altitude flights, around nuclear reactors, particle accelerators, during nuclear accidents or nuclear warfare. The various components used are Processors, Memory Device, Power Device, Communication Device, Microprocessors, FPGAs & ASICs, and Interface Components.
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The global Radiation Hardened Electronics and Semiconductors Market is anticipated to experience growth, due to increase in space missions carried out by various developed and developing countries.
The report includes the geographic segmentation of the Radiation Hardened Electronics and Semiconductors Market into four major regions: North America, Europe, Asia-Pacific, and Rest of the World. The report talks about Porter's five force analysis of this market along with, its value chain analysis. It also includes the recent developments in the market and describes the drivers and restraining factors for the same.
The report also segments the radiation hardened electronics & semiconductors market by components such as processors & controllers, memory devices, power management, FPGAs & ASICs, and other components.
The major players in the automated test equipment market include: Honeywell Aerospace (U.S.), BAE Systems (U.K.), Microsemi Corporation (U.S.), Xilinx Incorporation (U.S.) and Texas Instruments (U.S.).
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